27 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1002 series sp1002 general purpose esd protection - sp1002 series description back-to-back zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level speci?ed in the iec 61000-4- 2 international standard ( level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high- speed signal pins. pinout functional block diagram features t - p x d b q b d j u b o d f p g q ' (typ) i/o to i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, 15kv air discharge, ( level 4, iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m q b d l b h f t b w f t board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 2a (8/20s) applications t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t % j h j u b m $ b n f s b t t % f t l u p q t / p u f c p p l t t - $ % 1 % 1 5 7 t t 4 f u 5 p q # p y f t t % 7 % 1 m b z f s t t . 1 1 . 1 1 2 nc sp1002-01jtg 1 3 5 4 SP1002-02JTG nc (sc70-3) (sc70- 5 ) 1 2 1 3 5 4 sp1002-01jtg SP1002-02JTG life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example scart multimedia application of sp1002-01 2 x sp1002-01 multimedia device audio out l audio out r multimedia device audio in l audio in r sp1002 series 5pf 8kv bidirectional tvs array
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 28 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1002 series general purpose esd protection - sp1002 series electrical characteristics (t op = 25c) parameter symbol test conditions min typ max units voltage drop v d i r =1ma 8.0 8.8 9.5 v reverse standoff voltage v rwm i r 1a with 1 i/o at gnd 6.0 v leakage current i leak v r =5v with i/o at gnd 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 9.2 13.0 v i pp =2a, t p =8/20s, fwd 11.2 16.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 2.0 esd withstand voltage 1,2 v esd iec61000-4-2 (contact) 8 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c d reverse bias=0v 6 pf reverse bias=2.5v 5 pf reverse bias=5v 5 pf notes: 1 parameter is guaranteed by device characterization 2 a minimum of 1,000 esd pulses are applied at 1s intervals thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p reheat ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters
29 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1002 series sp1002 general purpose esd protection - sp1002 series package dimensions sc70-3 b 3 e he 2 1 e e d a2 a a1 c l 1.30 [0.0 5 12] 0.6 5 [0.02 5 6] 0.70 [0.0276] 1.90 [0.0748] 0.90 [0.03 5 4] package sc70-3 pins 3 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.66 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 solder pad layout package dimensions sc70-5 d a2 a a1 c l e he 2 1 3 6 5 not used 4 e e b package sc70-5 pins 5 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 solder pad layout product characteristics lead plating matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-203 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13.
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 30 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1002 series general purpose esd protection - sp1002 series embossed carrier tape & reel speci?cation sc70-3 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.30 2.50 0.090 0.098 a1 1.00 ref 0.039 ref b0 2.30 2.50 0.090 0.098 b1 1.90 ref 0.074 k0 1.10 1.30 0.043 0.051 k1 0.60 ref 0.023 ref t 0.27 max 0.010 po p2 ?d1 ?d ao a1 p ko f e w bo b1 t k1 embossed carrier tape & reel speci?cation sc70-5 and sc70-6 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.096 k0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max part numbering system ordering information part number package marking min. order qty. sp1002-01jtg sc70-3 bx1 3000 SP1002-02JTG sc70-5 bx2 3000 part marking system sp 1002 xx j t g series number of channels package t= tape & reel g= green j = sc70-3 sc70- 5 -01 = 1 channel, sc70-3 package -02 = 2 channel, sc70- 5 package C silicon protection array (spa tm ) family of tvs diode arrays bxx b x x product series assembly site number of channels b = sp1002 series (varies)
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